Company Milestones
2021-2023
- 2022 Build up Product application division
- Developed a full chip for optical sensors
- 12-nm, Enterprise PCIe Gen5 NVMe SSD project
- 28-nm, 5G Modem Chip project
- 2021 Established a SoC IC design division in Hsinchu HQ
2011-2020
- Developed AFE (16bit 60MspsADC+3chLED Driver) for MFP
- Developed 4ch 12.5Msps 120dB dynamic range AFE for smart grid
- Design of digital chip (CPU+DSPx7+Peripheral) for smart grid
- Developed a photodiode + amplifier chip for optical sensors
- Developed IO-LINK PHY chip
2007-2010
- 2007 Founded in Hsinchu Science Park and established a subsidiary in Japan
- Developed AFE (16bit50MspsADC+TG+H/V Driver) for DSC with 0.18umCMOS
- Developed AFE (16bit50MspsADC+H/V Driver) for DSC with 0.16umCMOS
- Developed 125Mhz 10bit DAC
- Two members of AA awarded prize at IEEE MILESTONE Award Ceremony
︿
